MULTILAYER CHIP SUPPRSORS (CHIP BEADS)積層式晶片磁珠
INTRODUION產品介紹
Multilayer chip beads are D components that cover a wide impedance charaeristic. Their impedance mainly compris ristive part, so when a component is inserted in seri with a ise conduion path, the ise content can be attenuated.
積層式晶片磁珠系表面黏著式晶片，涵蓋大范圍阻值，其阻主要由電阻性組成，所以當元件被安裝于一有雜訊傳導之通路，其雜訊可被衰減。
FEATUR特色
1. The all size chips generating high impedance.
尺寸小同時產生高阻值。
2. Excellent solderability and high heat ristance for either flow or reflow soldering.
優良的焊錫性及耐熱性，適合flow及reflow兩種焊錫方式。
3. Molithic struure for high reliability.
單石結?高信賴性。
4. Low DC ristance struure of elerode prevents wasteful eleric power consumption.
電之低直流阻值可避免不要之電力消耗。
APPLICATION適用產品
To supprs EMI/RFI and to prevent self-oscillation in eleronic produs such as:
為抑制EMI/RFI及避免電子產品之自我振蕩，例如：
1. Tablet, tebook, dk computers and peripheral equipments.平板、筆記型、桌上型電腦及其周邊設備。
2. Blu-ray DVD recorder, DSC, DVC, LCD Television.藍光?放影機、數位相機、數位攝影機、液晶電視機。
3. Mobile phone, art phone.行動電話、智慧手機。
4. Dial communication equipment.數位通訊設備。
5. Various eleronic equipments.各式電子設備。
6. Circuit where a stable ground is unavailable.缺乏穩定參考地之電路
。
