◆Viewing angle:120 deg
發光角度：120℃
◆The materials of the LED dice is InGaN
芯片成分
◆2.0mm&tim;1.2mm&tim;0.75mm T-LED
外型尺寸
◆Lens Appearance: Water Clear
膠體顏色：水色透明
◆ RoHS compliant lead-free soldering compatible
合ROHS（危害物質禁用指令）要求。
※Absolute maximum ratings at Ta=25℃額定值
Parameter 參數 | Symbol 號 | Value 值 | Unit 單位 |
Power dissipation功率耗損 | Pd | 65 | mW |
Forward current正向電流 | If | 30 | mA |
Reverse voltage反向電壓 | Vr | 5 | V |
Operating temperature range工作溫度范圍 | -40~+85 | ℃ | |
Storage temperature range貯存溫度范圍 | Tstg | -40~+100 | ℃ |
Peak pulsing current脈沖電流 | Ifp | 100 | mA |
Electrostatic Discharge靜電能力 | D | 2000(HBM) | V |
TE: IFP Conditions: Pulse Width≦10msec. and Duty cycle≦1/10.
IFP條件：脈沖持續時間≦10msec，占空因素≦1/10
※ Electrical-optical characteristics at Ta=25℃電性光電特性
Parameter 參數 | Tt Condition 測試條件 | Symbol 號 | Value值 | Unit 單位 | ||
Min. | T. | Max. | ||||
Forward voltage 正向電壓 | If=20mA | VF | 2.0 | -- | 2.4 | V |
Lumius intensity 發光強度 | If=20mA | Iv | 150 | -- | 200 | mcd |
Dominant welength 主波長 | If=20mA | WLD | 620 | -- | 630 | nm |
Viewing angle at 50% Iv 半功率角 | If=20mA | 2 θ 1/2 | -- | 120 | -- | Deg |
Reverse current 反向電流 | Vr=5V | Ir | -- | -- | 10 | mA |
TE: 1. Tolerance of lumius intensity is&plun;10%
發光強度公差為&plun;10%
2. Tolerance of forward voltage is&plun;0.05V
正向電壓公差&plun;0.05v
信賴性試驗
| 試驗類別Clification | 試驗項目 Tt Item | 試驗條件 Tt Condition | 試驗設備 Tt Equipment | 樣品數 Sample Size | 失敗率 Failure Rate |
| 耐久性試驗 Endurance Tt | 室溫通電試驗 Operation Life | Temp=(25&plun;5)℃ RH=(50&plun;10)%IF=20mA or 30mA or 50mACheck point: 0hr; 125hrs; 500hrs; 1000hrs | 燒機板 Burn in board | 20 | 0 |
| 高溫高濕儲存試驗 High Temperature High Humidity Storage | Temp=(85&plun;5)℃ RH=(90%~95%) Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒溫恒濕試驗機 Programmable Temp & Humidity Chamber | 20 | 0 | |
| 高溫高濕反向耐壓試驗 High Temperature High HumidityReverse Bias | Temp=(85&plun;5)℃ RH=(90%~95%) VR=5V Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒溫恒濕試驗機 DC=5V電源Programmable Temp & Humidity ChamberPower:DC=5V | 20 | 0 | |
| 高溫儲存試驗 High Temperature Storage | High Temp=(85&plun;5)℃ Check point: 0hr; 125hrs; 500hrs; 1000hrs | 烤箱 Oven | 20 | 0 | |
| 低溫儲存試驗 Low Temperature Storage | Low Temp=(-30&plun;5)℃ Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒溫恒濕試驗機 Programmable Temp & Humidity Chamber | 20 | 0 | |
| 環境試驗 EnvironmentalTt | 溫度循環試驗 Temperature Cycle Tt | (85&plun;5) ℃ ~ ( -30℃&plun;5) ℃ ~ (85&plun;5) ℃30min 120min 30 min 100minTt time: 0 cycle 10cycle 50cycle 100cycle | 可程式恒溫恒濕試驗機 Programmable Temp & Humidity Chamber | 20 | 0 |
| 冷熱沖擊試驗 Thermal Shock Tt | (110&plun;5) ℃ ~ ( -30℃&plun;5) ℃ ~ (110&plun;5) ℃15min 8min 15 min 8minTt time: 0 cycle 10cycle 50cycle 100cycle | 氣體式冷熱沖擊試驗機 Thermal Shock Tter (Air to Air) | 20 | 0 | |
| 回流焊試驗 Solder Ristance | Temp=260&plun;5℃ Dwell Time=10&plun;1sec; Tt tim=5 tim | 回流焊試驗機 Reflow Oven | 20 | 0 | |
| 焊接特性試驗 Solder ability | Temp=230&plun;5℃ Dwell Time=5&plun;1sec; | 錫爐 Tin furnace | 20 |
※Precautions for use使用規范
Reflow Profile回流焊規范
Pb-free Solder temperature Profile無鉛產品回流焊溫度條件曲線規范
te: a)Reflow soldering should t be done more than two tim.
材料焊接次數不過2次。
b)Do t put strs on the LEDs when soldering.
焊接時請不要重壓LED燈。
c)Do t warp the circuit board before it he been returned to rmal ambient conditions
after soldering.
焊接后溫度未回降到常溫時請勿扭曲線路板。
Hand Soldering Profile手工焊接規范
The temperature of the iron should be lower than 300℃and soldering within 3sec per solder-pad
is to be observed.
手工焊接時，烙鐵溫度不高于300℃，每個焊腳焊接時間不過3秒
Storage Profile貯存規范
1. Do t open the moisture proof bag before ready to use the LEDs
請在未準備使用LED之前不要打開靜電袋子。
2. The LEDs should be kept at 30℃or ls and 60%RH or ls before opening the package.
The max. storage period before opening the package is 1 year.
LED在未開封之前應保存在30℃以下，濕度在60%以下的環境中，長保存期為1年。
3. After opening the package, the LEDs should be kept at 30℃/40%RH or ls, and it should be
used within 7 days
打開包裝待后，LED需保存在30℃/40%濕度以下的條件，且須在7天內使用完。
4. If the LEDs be kept over the condition of 3, baking is required before mounting. Baking
condition as below: 60&plun;5℃for 12 hours
如果LED出了第3點要求，則LED須經過烘烤才能使用，烘烤條件為：60&plun;5℃，12個
小時
