◆Viewing angle:120 deg
發光角度：120℃
◆The materials of the LED dice is InGaN
芯片成分
◆2.0mm×1.2mm×0.75mm T-LED
外型尺寸
◆Lens Appearance: Water Clear
膠體顏色：水色透明
◆ RoHS compliant lead-free soldering compatible
合ROHS（危害物質禁用指令）要求。
信賴性試驗
| 試驗類別Clification | 試驗項目 Test Item | 試驗條件 Test Condition | 試驗設備 Test Equipment | 樣品數 Sample Size | 失敗率 Failure Rate |
| 耐久性試驗 Endurance Test | 室溫通電試驗 Operation Life | Temp=(25&plun;5)℃ RH=(50&plun;10)%IF=20mA or 30mA or 50mACheck point: 0hr; 125hrs; 500hrs; 1000hrs | 燒機板 Burn in board | 20 | 0 |
| 高溫高濕儲存試驗 High Temperature High Humidity Storage | Temp=(85&plun;5)℃ RH=(90%~95%) Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒溫恒濕試驗機 Programmable Temp & Humidity Chamber | 20 | 0 | |
| 高溫高濕反向耐壓試驗 High Temperature High HumidityReverse Bias | Temp=(85&plun;5)℃ RH=(90%~95%) VR=5V Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒溫恒濕試驗機 DC=5V電源Programmable Temp & Humidity ChamberPower:DC=5V | 20 | 0 | |
| 高溫儲存試驗 High Temperature Storage | High Temp=(85&plun;5)℃ Check point: 0hr; 125hrs; 500hrs; 1000hrs | 烤箱 Oven | 20 | 0 | |
| 低溫儲存試驗 Low Temperature Storage | Low Temp=(-30&plun;5)℃ Check point: 0hr; 125hrs; 500hrs; 1000hrs | 可程式恒溫恒濕試驗機 Programmable Temp & Humidity Chamber | 20 | 0 | |
| 環境試驗 EnvironmentalTest | 溫度循環試驗 Temperature Cycle Test | (85&plun;5) ℃ ~ ( -30℃&plun;5) ℃ ~ (85&plun;5) ℃30min 120min 30 min 100minTest time: 0 cycle 10cycle 50cycle 100cycle | 可程式恒溫恒濕試驗機 Programmable Temp & Humidity Chamber | 20 | 0 |
| 冷熱沖擊試驗 Thermal Shock Test | (110&plun;5) ℃ ~ ( -30℃&plun;5) ℃ ~ (110&plun;5) ℃15min 8min 15 min 8minTest time: 0 cycle 10cycle 50cycle 100cycle | 氣體式冷熱沖擊試驗機 Thermal Shock Tester (Air to Air) | 20 | 0 | |
| 回流焊試驗 Solder Resistance | Temp=260&plun;5℃ Dwell Time=10&plun;1sec; Test times=5 times | 回流焊試驗機 Reflow Oven | 20 | 0 | |
| 焊接特性試驗 Solder ability | Temp=230&plun;5℃ Dwell Time=5&plun;1sec; | 錫爐 Tin furnace | 20 |
※Precautions for use使用規范
Reflow Profile回流焊規范
Pb-free Solder temperature Profile無鉛產品回流焊溫度條件曲線規范
Note: a)Reflow soldering should not be done more than two times.
材料焊接次數不過2次。
b)Do not put stress on the LEDs when soldering.
焊接時請不要重壓LED燈。
c)Do not warp the circuit board before it have been returned to normal ambient conditions
after soldering.
焊接后溫度未回降到常溫時請勿扭曲線路板。
Hand Soldering Profile手工焊接規范
The temperature of the iron should be lower than 300℃and soldering within 3sec per solder-pad
is to be observed.
手工焊接時，烙鐵溫度不高于300℃，每個焊腳焊接時間不過3秒
Storage Profile貯存規范
1. Do not open the moisture proof bag before ready to use the LEDs
請在未準備使用LED之前不要打開靜電袋子。
2. The LEDs should be kept at 30℃or less and 60%RH or less before opening the package.
The max. storage period before opening the package is 1 year.
LED在未開封之前應保存在30℃以下，濕度在60%以下的環境中，長保存期為1年。
3. After opening the package, the LEDs should be kept at 30℃/40%RH or less, and it should be
used within 7 days
打開包裝待后，LED需保存在30℃/40%濕度以下的條件，且須在7天內使用完。
4. If the LEDs be kept over the condition of 3, baking is required before mounting. Baking
condition as below: 60&plun;5℃for 12 hours
如果LED出了第3點要求，則LED須經過烘烤才能使用，烘烤條件為：60&plun;5℃，12個
小時
